Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Bok Eng Cheah, Jackson Chung Peng Kong, Loke Yip Foo | 2022-12-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Bok Eng Cheah, Jackson Chung Peng Kong, Loke Yip Foo | 2022-12-13 |