Issued Patents 2022
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282780 | Integrated bridge for die-to-die interconnects | Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2022-03-22 |
| 11284518 | Semiconductor package with co-axial ball-grid-array | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2022-03-22 |
| 11227841 | Stiffener build-up layer package | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2022-01-18 |