Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Sujit Sharan, Tin Poay Chuah, Ananth Prabhakumar | 2022-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Sujit Sharan, Tin Poay Chuah, Ananth Prabhakumar | 2022-06-07 |