Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291133 | Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket | Zhichao Zhang, Kuang Liu, Kemal Aygun | 2022-03-29 |