Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11464139 | Conformable heat sink interface with a high thermal conductivity | Kelly Lofgreen, Joseph B. Petrini, Todd Coons, Christopher Wade Ackerman, Edvin Cetegen +2 more | 2022-10-04 |
| 11291133 | Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket | Zhichao Zhang, Gregorio R. Murtagian, Kemal Aygun | 2022-03-29 |