Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462457 | Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates | Krishna Vasanth Valavala, Chandra Mohan Jha | 2022-10-04 |
| 11464139 | Conformable heat sink interface with a high thermal conductivity | Joseph B. Petrini, Todd Coons, Christopher Wade Ackerman, Edvin Cetegen, Yang Jiao +2 more | 2022-10-04 |