Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502008 | Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control | Nicholas S. Haehn, Shankar Devasenathipathy | 2022-11-15 |
| 11464139 | Conformable heat sink interface with a high thermal conductivity | Kelly Lofgreen, Joseph B. Petrini, Todd Coons, Christopher Wade Ackerman, Yang Jiao +2 more | 2022-10-04 |
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2022-03-22 |