Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more | 2022-12-06 |
| 11508645 | Modular technique for die-level liquid cooling | Je-Young Chang | 2022-11-22 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao +1 more | 2022-11-15 |
| 11462457 | Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates | Krishna Vasanth Valavala, Kelly Lofgreen | 2022-10-04 |
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot | 2022-09-27 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Weihua Tang +2 more | 2022-07-26 |
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang +2 more | 2022-07-12 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |