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Microelectronic assemblies having a cooling channel |
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Modular technique for die-level liquid cooling |
Je-Young Chang |
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| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao +1 more |
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Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates |
Krishna Vasanth Valavala, Kelly Lofgreen |
2022-10-04 |
| 11456232 |
Thermal assemblies for multi-chip packages |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot |
2022-09-27 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
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| 11387224 |
Phase change material in substrate cavity |
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| 11322456 |
Die back side structures for warpage control |
Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Je-Young Chang, Kyle Yazzie +2 more |
2022-05-03 |