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Microelectronic assemblies having a cooling channel |
Zhimin Wan, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang +3 more |
2022-12-06 |
| 11508636 |
Multi-layer solution based deposition of dielectrics for advanced substrate architectures |
Andrew J. Brown, Ji-Yong Park, Siddharth K. Alur, Amruthavalli Pallavi Alur |
2022-11-22 |
| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more |
2022-11-15 |
| 11482471 |
Thermal management solutions for integrated circuit packages |
Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang +3 more |
2022-10-25 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-08-16 |
| 11387224 |
Phase change material in substrate cavity |
Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more |
2022-07-12 |
| 11380609 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang +2 more |
2022-07-05 |
| 11355459 |
Embedding magnetic material, in a cored or coreless semiconductor package |
Kyu Oh Lee, Sai Vadlamani, Rahul Jain, Junnan Zhao, Ji-Yong Park +1 more |
2022-06-07 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more |
2022-05-17 |
| 11322290 |
Techniques for an inductor at a first level interface |
Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more |
2022-05-03 |
| 11246218 |
Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate |
Chong Zhang, Ying Wang, Junnan Zhao, Yikang Deng |
2022-02-08 |
| 11217534 |
Galvanic corrosion protection for semiconductor packages |
Junnan Zhao, Ji-Yong Park, Kyu Oh Lee |
2022-01-04 |