Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang +3 more | 2022-12-06 |
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Ji-Yong Park, Siddharth K. Alur, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more | 2022-11-15 |
| 11482471 | Thermal management solutions for integrated circuit packages | Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang +3 more | 2022-10-25 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-08-16 |
| 11387224 | Phase change material in substrate cavity | Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang +2 more | 2022-07-05 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Sai Vadlamani, Rahul Jain, Junnan Zhao, Ji-Yong Park +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11322290 | Techniques for an inductor at a first level interface | Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2022-05-03 |
| 11246218 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Junnan Zhao, Yikang Deng | 2022-02-08 |
| 11217534 | Galvanic corrosion protection for semiconductor packages | Junnan Zhao, Ji-Yong Park, Kyu Oh Lee | 2022-01-04 |