| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
| 11443885 |
Thin film barrier seed metallization in magnetic-plugged through hole inductor |
Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more |
2022-09-13 |
| 11432405 |
Methods for attaching large components in a package substrate for advanced power delivery |
Prithwish Chatterjee, Kyu Oh Lee |
2022-08-30 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more |
2022-08-16 |
| 11410921 |
Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films |
Kyu Oh Lee |
2022-08-09 |
| 11355459 |
Embedding magnetic material, in a cored or coreless semiconductor package |
Kyu Oh Lee, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more |
2022-06-07 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Andrew J. Brown +3 more |
2022-05-17 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Lauren A. Link, Andrew J. Brown +2 more |
2022-02-15 |
| 11244912 |
Semiconductor package having a coaxial first layer interconnect |
Sai Vadlamani, Aleksandar Aleksov, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more |
2022-02-08 |