Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown | 2022-11-08 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Sameer Paital +2 more | 2022-09-13 |
| 11432405 | Methods for attaching large components in a package substrate for advanced power delivery | Rahul Jain, Kyu Oh Lee | 2022-08-30 |
| 11335632 | Magnetic inductor structures for package devices | Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain, Andrew J. Brown +3 more | 2022-05-17 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Sai Vadlamani, Lauren A. Link, Andrew J. Brown | 2022-03-29 |
| 11270959 | Enabling magnetic films in inductors integrated into semiconductor packages | Kirstof Darmawikarta, Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen | 2022-03-08 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2022-02-15 |