Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie +2 more | 2022-12-06 |
| 11508662 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2022-11-22 |
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Yi Li | 2022-09-13 |
| 11270959 | Enabling magnetic films in inductors integrated into semiconductor packages | Kirstof Darmawikarta, Srinivas V. Pietambaram, Prithwish Chatterjee, Sri Ranga Sai Boyapati | 2022-03-08 |