Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516915 | Reduced capacitance land pad | Zhichao Zhang, Gaurav Chawla, Jeffrey Lee | 2022-11-29 |
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2022-09-13 |
| 11217866 | Battery module for improving safety | Chin-Din Hou | 2022-01-04 |