Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Gang Duan +2 more | 2022-12-06 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more | 2022-05-03 |