| 11532584 |
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling |
Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more |
2022-12-20 |
$12,719,000 |
| 11508662 |
Device and method of very high density routing used with embedded multi-die interconnect bridge |
Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta |
2022-11-22 |
$12,862,000 |
| 11488918 |
Surface finishes with low rBTV for fine and mixed bump pitch architectures |
Kristof Darmawaikarta, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Steve Cho +7 more |
2022-11-01 |
$18,130,000 |
| 11430740 |
Microelectronic device with embedded die substrate on interposer |
Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more |
2022-08-30 |
$13,077,000 |
| 11393766 |
Multi-chip package with high density interconnects |
Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Sri Ranga Sai Boyapati |
2022-07-19 |
$11,394,000 |
| 11373951 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more |
2022-06-28 |
$15,065,000 |
| 11322444 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more |
2022-05-03 |
$16,346,000 |
| 11309192 |
Integrated circuit package supports |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov |
2022-04-19 |
$22,207,000 |
| 11309239 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more |
2022-04-19 |
$22,207,000 |
| 11302643 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2022-04-12 |
$16,909,000 |
| 11272619 |
Apparatus with embedded fine line space in a cavity, and a method for forming the same |
Kristof Darmawikarta, Yikang Deng, Ji-Yong Park, Maroun D. Moussallem, Amruthavalli Pallavi Alur +2 more |
2022-03-08 |
$16,017,000 |
| 11264346 |
Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Hiroki Tanaka |
2022-03-01 |
$16,941,000 |
| 11264307 |
Dual-damascene zero-misalignment-via process for semiconductor packaging |
Aleksandar Aleksov, Hiroki Tanaka, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more |
2022-03-01 |
$16,941,000 |
| 11264239 |
Polarization defined zero misalignment vias for semiconductor packaging |
Hiroki Tanaka, Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta |
2022-03-01 |
$16,941,000 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2022-02-15 |
$14,138,000 |
| 11244912 |
Semiconductor package having a coaxial first layer interconnect |
Sai Vadlamani, Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta +2 more |
2022-02-08 |
$27,206,000 |
| 11233009 |
Embedded multi-die interconnect bridge having a molded region with through-mold vias |
Praneeth Akkinepally, Frank Truong, Jason M. Gamba |
2022-01-25 |
$21,146,000 |
