Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462432 | Dual side de-bonding in component carriers using photoablation | Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba, Brandon C. Marin | 2022-10-04 |
| 11348865 | Electronic device including a substrate having interconnects | Praneeth Akkinepally, Jieying Kong | 2022-05-31 |
| 11296186 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne | 2022-04-05 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |
| 11233009 | Embedded multi-die interconnect bridge having a molded region with through-mold vias | Praneeth Akkinepally, Jason M. Gamba, Robert Alan May | 2022-01-25 |