Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, Frank Truong, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |