Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2022-12-20 |
| 11508676 | Density-graded adhesion layer for conductors | Rahul N. Manepalli, Kemal Aygun, Cemil Geyik | 2022-11-22 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Steve Cho +7 more | 2022-11-01 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee, Sameer Paital +2 more | 2022-09-13 |
| 11380472 | High-permeability magnetic-dielectric film-based inductors | Kristof Darmawikarta, Rahul N. Manepalli | 2022-07-05 |
| 11355438 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Rahul N. Manepalli, Gang Duan | 2022-06-07 |
| 11348718 | Substrate embedded magnetic core inductors and method of making | Kristof Darmawikarta, Gang Duan, Yonggang Li, Sameer Paital | 2022-05-31 |
| 11322290 | Techniques for an inductor at a first level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Ying Wang +3 more | 2022-05-03 |
| 11309239 | Electromigration resistant and profile consistent contact arrays | Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2022-04-19 |
| 11309192 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2022-04-19 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Rahul N. Manepalli, David Unruh, Frank Truong, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |
| 11270959 | Enabling magnetic films in inductors integrated into semiconductor packages | Kirstof Darmawikarta, Prithwish Chatterjee, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen | 2022-03-08 |
| 11264307 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu +2 more | 2022-03-01 |
| 11227849 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Brandon C. Marin, Kristof Darmawikarta, Gang Duan, Sameer Paital | 2022-01-18 |