| 11526103 |
Image forming apparatus capable of suppressing image defect due to foreign matter |
Satoru Motohashi, Nobuo Oshima, Akihisa Matsukawa, Katsuichi Abe, Takayuki Namiki |
2022-12-13 |
| 11517881 |
Exhaust gas purification catalyst |
Haruka Shimizu, Masaaki Inamura |
2022-12-06 |
| 11505932 |
Water supply mechanism and flush toilet |
Hideaki Kashimura |
2022-11-22 |
| 11488918 |
Surface finishes with low rBTV for fine and mixed bump pitch architectures |
Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more |
2022-11-01 |
| 11461938 |
Ultrasonic imaging device and image processing device |
Kazuhiro Yamanaka, Junichi Shiokawa, Tomofumi Nishiura |
2022-10-04 |
| 11458460 |
Exhaust gas purification catalyst |
Yuki Nagao, Tokuya WATANABE |
2022-10-04 |
| 11373951 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Jeremy Ecton, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more |
2022-06-28 |
| RE49057 |
Position detection apparatus, droplet discharging apparatus, method for detecting position, and medium |
Yasunari Harada, Jun Watanabe, Tetsuyoshi Nakata, Toshiaki Hosokawa, Shunsuke Shitaoka |
2022-05-03 |
| 11320176 |
Thermoacoustic device with diaphragm structure |
Tatsuma Kouchi, Tomoyuki Takei, Kunio OHARA, Osamu Ishikawa |
2022-05-03 |
| 11322444 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Robert Alan May, Sameer Paital, Bai Nie, Jesse C. Jones +1 more |
2022-05-03 |
| 11309834 |
High-power terahertz oscillator |
Masahiro Asada, Safumi Suzuki |
2022-04-19 |
| 11309239 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more |
2022-04-19 |
| 11264239 |
Polarization defined zero misalignment vias for semiconductor packaging |
Aleksandar Aleksov, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta |
2022-03-01 |
| 11264346 |
Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Robert Alan May |
2022-03-01 |
| 11264307 |
Dual-damascene zero-misalignment-via process for semiconductor packaging |
Aleksandar Aleksov, Robert Alan May, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more |
2022-03-01 |
