Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11528811 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Nicholas S. Haehn, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2022-12-13 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2022-06-28 |