Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11528811 | Method, device and system for providing etched metallization structures | Nicholas S. Haehn, Oscar Ojeda, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2022-12-13 | $11,573,000 |
| 11404389 | In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages | Suddhasattwa Nad, Kristof Darmawikarta, Yonggang Li, Xiaoying Guo | 2022-08-02 | $13,520,000 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2022-06-28 | $15,065,000 |