Issued Patents 2022
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538803 | Integration of III-V transistors in a silicon CMOS stack | Gilbert Dewey, Telesphor Kamgaing, Gerogios Dogiamis, Hyung-Jin Lee | 2022-12-27 |
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more | 2022-12-20 |
| 11532574 | Through-substrate waveguide | Georgios Dogiamis, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee | 2022-12-20 |
| 11502037 | Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating | Veronica Strong, Brandon M. Rawlings | 2022-11-15 |
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown | 2022-11-08 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11462480 | Microelectronic assemblies having interposers | Johanna M. Swan | 2022-10-04 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11437706 | Package with side-radiating wave launcher and waveguide | Georgios Dogiamis, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee | 2022-09-06 |
| 11430751 | Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications | Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster | 2022-08-30 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Adel A. Elsherbini, Feras Eid, Veronica Strong, Johanna M. Swan | 2022-08-23 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Shawna M. Liff, Feras Eid, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more | 2022-08-23 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff +2 more | 2022-07-19 |
| 11393766 | Multi-chip package with high density interconnects | Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2022-07-19 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Jianyong Xie, Sujit Sharan, Henning Braunisch | 2022-07-12 |
| 11360512 | Electronic device fabric integration | Nadine L. Dabby, Sasha N. Oster, Braxton Lathrop, Racquel L. Fygenson | 2022-06-14 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2022-05-31 |
| 11348882 | Package spark gap structure | Feras Eid, Johanna M. Swan, Adel A. Elsherbini, Veronica Strong | 2022-05-31 |
| 11335641 | Microelectronic assemblies | Johanna M. Swan | 2022-05-17 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Feras Eid, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 11328996 | Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating | Veronica Strong, Brandon M. Rawlings | 2022-05-10 |
| 11316497 | Multi-filter die | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-04-26 |
| 11309192 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan | 2022-04-19 |
| 11310907 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-04-19 |