| 11532719 |
Transistors on heterogeneous bonding layers |
Kimin Jun, Jack T. Kavalieros, Gilbert Dewey, Willy Rachmady, Aaron D. Lilak +5 more |
2022-12-20 |
$12,719,000 |
| 11522072 |
Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices |
Rishabh Mehandru, Ranjith Kumar, Cory E. Weber, Seiyon Kim, Stephen M. Cea +1 more |
2022-12-06 |
$14,727,000 |
| 11515318 |
3D floating-gate multiple-input device |
Aaron D. Lilak, Sayed Hasan |
2022-11-29 |
$14,086,000 |
| 11482621 |
Vertically stacked CMOS with upfront M0 interconnect |
Willy Rachmady, Aaron D. Lilak, Rishabh Mehandru, Cheng-Ying Huang, Gilbert Dewey +4 more |
2022-10-25 |
$11,792,000 |
| 11462568 |
Stacked thin film transistors |
Aaron D. Lilak, Justin R. Weber, Harold W. Kennel, Willy Rachmady, Gilbert Dewey +3 more |
2022-10-04 |
$13,460,000 |
| 11444166 |
Backside source/drain replacement for semiconductor devices with metallization on both sides |
Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Mauro J. Kobrinsky |
2022-09-13 |
$14,653,000 |
| 11437405 |
Transistors stacked on front-end p-type transistors |
Gilbert Dewey, Aaron D. Lilak, Willy Rachmady, Anh Phan, Ehren Mannebach +4 more |
2022-09-06 |
$12,766,000 |
| 11437283 |
Backside contacts for semiconductor devices |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more |
2022-09-06 |
$12,766,000 |
| 11430814 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Willy Rachmady, Gilbert Dewey, Jessica M. Torres +6 more |
2022-08-30 |
$13,077,000 |
| 11424160 |
Self-aligned local interconnects |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more |
2022-08-23 |
$15,804,000 |
| 11404319 |
Vertically stacked finFETs and shared gate patterning |
Aaron D. Lilak, Sean T. Ma, Justin R. Weber, Rishabh Mehandru, Stephen M. Cea +1 more |
2022-08-02 |
$13,520,000 |
| 11398479 |
Heterogeneous Ge/III-V CMOS transistor structures |
Willy Rachmady, Abhishek A. Sharma, Ravi Pillarisetty, Rishabh Mehandru, Aaron D. Lilak +2 more |
2022-07-26 |
$27,041,000 |
| 11393777 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more |
2022-07-19 |
$11,394,000 |
| 11393818 |
Stacked transistors with Si PMOS and high mobility thin film transistor NMOS |
Gilbert Dewey, Ravi Pillarisetty, Abhishek A. Sharma, Aaron D. Lilak, Willy Rachmady +5 more |
2022-07-19 |
$11,394,000 |
| 11387238 |
Non-silicon N-Type and P-Type stacked transistors for integrated circuit devices |
Gilbert Dewey, Ravi Pillarisetty, Rishabh Mehandru, Cheng-Ying Huang, Willy Rachmady +1 more |
2022-07-12 |
$13,106,000 |
| 11380684 |
Stacked transistor architecture including nanowire or nanoribbon thin film transistors |
Gilbert Dewey, Aaron D. Lilak, Cheng-Ying Huang, Jack T. Kavalieros, Willy Rachmady +4 more |
2022-07-05 |
$18,093,000 |
| 11374004 |
Pedestal fin structure for stacked transistor integration |
Aaron D. Lilak, Rishabh Mehandru, Anh Phan, Gilbert Dewey, Willy Rachmady +5 more |
2022-06-28 |
$15,065,000 |
| 11348897 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2022-05-31 |
$16,893,000 |
| 11342227 |
Stacked transistor structures with asymmetrical terminal interconnects |
Aaron D. Lilak, Ehren Mannebach, Nafees Kabir, Gilbert Dewey, Willy Rachmady +1 more |
2022-05-24 |
$18,289,000 |
| 11328951 |
Transistor cells including a deep via lined wit h a dielectric material |
Mauro J. Kobrinsky, Rishabh Mehandru |
2022-05-10 |
$19,182,000 |
| 11264493 |
Wrap-around source/drain method of making contacts for backside metals |
Kimin Jun, Il-Seok Son, Donald W. Nelson |
2022-03-01 |
$16,941,000 |
| 11264405 |
Semiconductor diodes employing back-side semiconductor or metal |
Rishabh Mehandru, Nathan Jack |
2022-03-01 |
$16,941,000 |
| 11257738 |
Vertically stacked transistor devices with isolation wall structures containing an electrical conductor |
Aaron D. Lilak, Anh Phan, Stephanie A. Bojarski |
2022-02-22 |
$16,582,000 |
| 11257929 |
Stacked transistors |
Rishabh Mehandru, Aaron D. Lilak |
2022-02-22 |
$16,582,000 |
| 11251156 |
Fabrication and use of through silicon vias on double sided interconnect device |
Brennen Mueller, Kimin Jun, Paul B. Fischer, Daniel Pantuso |
2022-02-15 |
$14,138,000 |
