Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532719 | Transistors on heterogeneous bonding layers | Kimin Jun, Jack T. Kavalieros, Gilbert Dewey, Willy Rachmady, Aaron D. Lilak +5 more | 2022-12-20 |
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski +1 more | 2022-12-20 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya +3 more | 2022-12-13 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2022-08-02 |
| 11393777 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Shawna M. Liff +2 more | 2022-07-19 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more | 2022-05-31 |
| 11251156 | Fabrication and use of through silicon vias on double sided interconnect device | Patrick Morrow, Kimin Jun, Paul B. Fischer, Daniel Pantuso | 2022-02-15 |