| 11444024 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2022-09-13 |
| 11417567 |
Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom |
Florian Gstrein, Eungnak Han, Rami Hourani, Ruth A. Brain, Paul A. Nyhus +2 more |
2022-08-16 |
| 11404482 |
Self-aligned repeatedly stackable 3D vertical RRAM |
Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Gurpreet Singh, Nafees Kabir +4 more |
2022-08-02 |
| 11404307 |
Interconnect structures and methods of fabrication |
Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more |
2022-08-02 |
| 11373950 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2022-06-28 |
| 11335598 |
Grating replication using helmets and topographically-selective deposition |
Kevin Lin, Sudipto Naskar, Miriam Reshotko, Rami Hourani |
2022-05-17 |
| 11264449 |
Capacitor architectures in semiconductor devices |
Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin |
2022-03-01 |
| 11264325 |
Interconnects having a portion without a liner material and related structures, devices, and methods |
Richard E. Schenker, Tristan A. Tronic |
2022-03-01 |
| 11251117 |
Self aligned gratings for tight pitch interconnects and methods of fabrication |
Leonard P. GULER, Paul A. Nyhus, Gobind Bisht, Jonathan Laib, David Shykind +5 more |
2022-02-15 |
| 11239156 |
Planar slab vias for integrated circuit interconnects |
Elijah V. Karpov, Nafees Kabir |
2022-02-01 |
| 11239112 |
Passivating silicide-based approaches for conductive via fabrication and structures resulting therefrom |
Sudipto Naskar, Richard E. Schenker |
2022-02-01 |
| 11227766 |
Metal oxide nanoparticles as fillable hardmask materials |
Marie Krysak, Florian Gstrein |
2022-01-18 |