Issued Patents 2022
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502031 | Multiple layer metal-insulator-metal (MIM) structure | — | 2022-11-15 |
| 11482622 | Adhesion structure for thin film transistor | Abhishek A. Sharma, Carl Naylor, Urusa Alaan, Christopher J. Jezewski, Ashish Agrawal | 2022-10-25 |
| 11469189 | Inductor and transmission line with air gap | — | 2022-10-11 |
| 11462469 | Single mask lithography line end enhancement | Nafees Kabir, Richard E. Schenker | 2022-10-04 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski, Jiun-Ruey Chen +10 more | 2022-09-13 |
| 11437255 | Epitaxial III-N nanoribbon structures for device fabrication | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Paul B. Fischer | 2022-09-06 |
| 11404482 | Self-aligned repeatedly stackable 3D vertical RRAM | Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Manish Chandhok, Gurpreet Singh +4 more | 2022-08-02 |
| 11398545 | Single-mask, high-q performance metal-insulator-metal capacitor (MIMCAP) | Han Wui Then | 2022-07-26 |
| 11373950 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Florian Gstrein, James M. Blackwell, Marie Krysak +6 more | 2022-06-28 |
| 11373900 | Damascene plug and tab patterning with photobuckets | Robert L. Bristol, Richard E. Schenker | 2022-06-28 |
| 11367684 | Recessed metal interconnects to mitigate EPE-related via shorting | Ehren Mannebach, Richard Vreeland | 2022-06-21 |
| 11367682 | Vias and gaps in semiconductor interconnects | — | 2022-06-21 |
| 11335777 | Integrated circuit components with substrate cavities | Paul B. Fischer, Han Wui Then, Sansaptak Dasgupta, Marko Radosavljevic, Ibrahim Ban | 2022-05-17 |
| 11335598 | Grating replication using helmets and topographically-selective deposition | Sudipto Naskar, Manish Chandhok, Miriam Reshotko, Rami Hourani | 2022-05-17 |
| 11328992 | Integrated circuit components with dummy structures | Nicholas James Harold McKubre, Richard Vreeland, Sansaptak Dasgupta | 2022-05-10 |
| 11276581 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Robert L. Bristol, Alan M. Myers | 2022-03-15 |
| 11276644 | Integrated circuits and methods for forming thin film crystal layers | Carl Naylor, Ashish Agrawal, Abhishek A. Sharma, Mauro J. Kobrinsky, Christopher J. Jezewski +1 more | 2022-03-15 |
| 11251072 | Differential hardmasks for modulation of electrobucket sensitivity | Robert L. Bristol, James M. Blackwell, Rami Hourani, Marie Krysak | 2022-02-15 |