Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Michael Christenson, Christopher J. Jezewski, Jiun-Ruey Chen +10 more | 2022-09-13 |
| 11430814 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2022-08-30 |
| 11300885 | EUV phase-shift SRAF masks by means of embedded phase shift layers | Robert L. Bristol, Guojing Zhang, John Magana, Chang Ju Choi, Arvind Sundaramurthy +1 more | 2022-04-12 |
| 11264325 | Interconnects having a portion without a liner material and related structures, devices, and methods | Manish Chandhok, Richard E. Schenker | 2022-03-01 |