Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522059 | Metallic sealants in transistor arrangements | Abhishek A. Sharma, Tahir Ghani, Jack T. Kavalieros, Gilbert Dewey, Van H. Le +1 more | 2022-12-06 |
| 11482622 | Adhesion structure for thin film transistor | Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan, Ashish Agrawal | 2022-10-25 |
| 11462684 | Retention improvement by high-k encapsulation of RRAM devices | Albert Chen, Nathan Strutt, Oleg Golonzka, Pedro Quintero, Elijah V. Karpov | 2022-10-04 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jiun-Ruey Chen +10 more | 2022-09-13 |
| 11444205 | Contact stacks to reduce hydrogen in thin film transistor | Arnab Sen Gupta, Matthew V. Metz, Benjamin Chu-Kung, Abhishek A. Sharma, Van H. Le +7 more | 2022-09-13 |
| 11430814 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2022-08-30 |
| 11393722 | Isolation wall stressor structures to improve channel stress and their methods of fabrication | Aaron D. Lilak, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey, Anh Phan | 2022-07-19 |
| 11380617 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Jasmeet S. Chawla | 2022-07-05 |
| 11328993 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2022-05-10 |
| 11276644 | Integrated circuits and methods for forming thin film crystal layers | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more | 2022-03-15 |