| 11522059 |
Metallic sealants in transistor arrangements |
Abhishek A. Sharma, Tahir Ghani, Jack T. Kavalieros, Gilbert Dewey, Van H. Le +1 more |
2022-12-06 |
| 11482622 |
Adhesion structure for thin film transistor |
Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan, Ashish Agrawal |
2022-10-25 |
| 11462684 |
Retention improvement by high-k encapsulation of RRAM devices |
Albert Chen, Nathan Strutt, Oleg Golonzka, Pedro Quintero, Elijah V. Karpov |
2022-10-04 |
| 11444024 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jiun-Ruey Chen +10 more |
2022-09-13 |
| 11444205 |
Contact stacks to reduce hydrogen in thin film transistor |
Arnab Sen Gupta, Matthew V. Metz, Benjamin Chu-Kung, Abhishek A. Sharma, Van H. Le +7 more |
2022-09-13 |
| 11430814 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more |
2022-08-30 |
| 11393722 |
Isolation wall stressor structures to improve channel stress and their methods of fabrication |
Aaron D. Lilak, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey, Anh Phan |
2022-07-19 |
| 11380617 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Jasmeet S. Chawla |
2022-07-05 |
| 11328993 |
Cobalt based interconnects and methods of fabrication thereof |
Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver |
2022-05-10 |
| 11276644 |
Integrated circuits and methods for forming thin film crystal layers |
Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more |
2022-03-15 |