Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski, Brennen Mueller +1 more | 2022-12-20 |
| 11482622 | Adhesion structure for thin film transistor | Kevin Lin, Abhishek A. Sharma, Urusa Alaan, Christopher J. Jezewski, Ashish Agrawal | 2022-10-25 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11276644 | Integrated circuits and methods for forming thin film crystal layers | Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky, Christopher J. Jezewski +1 more | 2022-03-15 |