Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Ramanan V. Chebiam, William Brezinski, Brennen Mueller +1 more | 2022-12-20 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more | 2022-08-02 |
| 11367684 | Recessed metal interconnects to mitigate EPE-related via shorting | Ehren Mannebach, Kevin Lin | 2022-06-21 |
| 11328992 | Integrated circuit components with dummy structures | Kevin Lin, Nicholas James Harold McKubre, Sansaptak Dasgupta | 2022-05-10 |
| 11289421 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Colin T. Carver, William Brezinski, Michael Christenson, Nafees Kabir | 2022-03-29 |