Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, Brennen Mueller +1 more | 2022-12-20 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more | 2022-08-02 |
| 11289421 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, Michael Christenson, Nafees Kabir | 2022-03-29 |