Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Christopher J. Jezewski, Jiun-Ruey Chen +10 more | 2022-09-13 |
| 11289421 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, William Brezinski, Nafees Kabir | 2022-03-29 |