Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, William Brezinski, Brennen Mueller +1 more | 2022-12-20 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2022-08-02 |
| 11328993 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver | 2022-05-10 |