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Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2022-09-13 |
| 11406972 |
Activation of protected cross-linking catalysts during formation of dielectric materials |
David J. Michalak, Jessica M. Torres, Marie Krysak, Jeffery D. Bielefeld |
2022-08-09 |
| 11373950 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more |
2022-06-28 |
| 11320734 |
Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists |
Marie Krysak, Robert L. Bristol, Florian Gstrein |
2022-05-03 |
| 11315798 |
Two-stage bake photoresist with releasable quencher |
Robert L. Bristol, Marie Krysak, Florian Gstrein, Kent N. FRASURE |
2022-04-26 |
| 11262654 |
Chain scission resist compositions for EUV lithography applications |
Lauren Doyle, Marie Krysak, Patrick Theofanis, Eungnak Han |
2022-03-01 |
| 11251072 |
Differential hardmasks for modulation of electrobucket sensitivity |
Kevin Lin, Robert L. Bristol, Rami Hourani, Marie Krysak |
2022-02-15 |
| 11232980 |
Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication |
Florian Gstrein, Rami Hourani, Gopinath Bhimarasetti |
2022-01-25 |
| 11217455 |
Carbon-based dielectric materials for semiconductor structure fabrication and the resulting structures |
Tayseer Mahdi |
2022-01-04 |
| 11217456 |
Selective etching and controlled atomic layer etching of transition metal oxide films for device fabrication |
Scott B. Clendenning, Cen Tan, Marie Krysak |
2022-01-04 |