| 11532724 |
Selective gate spacers for semiconductor devices |
Scott B. Clendenning, Szuya S. Liao, Rami Hourani, Patricio E. Romero, Grant Kloster +1 more |
2022-12-20 |
| 11476164 |
Integrated circuit structures having differentiated workfunction layers |
Ying-Feng PANG, Dan S. LAVRIC, Ashish Agrawal, Robert Niffenegger, Padmanava Sadhukhan +2 more |
2022-10-18 |
| 11456248 |
Etch stop layer-based approaches for conductive via fabrication and structures resulting therefrom |
Cen Tan, Rami Hourani |
2022-09-27 |
| 11417567 |
Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom |
Eungnak Han, Rami Hourani, Ruth A. Brain, Paul A. Nyhus, Manish Chandhok +2 more |
2022-08-16 |
| 11398428 |
Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom |
Eungnak Han, Tayseer Mahdi, Rami Hourani, Gurpreet Singh |
2022-07-26 |
| 11373950 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, James M. Blackwell, Marie Krysak +6 more |
2022-06-28 |
| 11320734 |
Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists |
Marie Krysak, James M. Blackwell, Robert L. Bristol |
2022-05-03 |
| 11315798 |
Two-stage bake photoresist with releasable quencher |
Robert L. Bristol, Marie Krysak, James M. Blackwell, Kent N. FRASURE |
2022-04-26 |
| 11270887 |
Passivation layer for germanium substrate |
Patricio E. Romero, Scott B. Clendenning, Cen Tan |
2022-03-08 |
| 11232980 |
Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication |
Rami Hourani, Gopinath Bhimarasetti, James M. Blackwell |
2022-01-25 |
| 11227766 |
Metal oxide nanoparticles as fillable hardmask materials |
Marie Krysak, Manish Chandhok |
2022-01-18 |
| 11227798 |
Metal aluminum gallium indium carbide thin films as liners and barriers for interconnects |
Scott B. Clendenning |
2022-01-18 |