Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417567 | Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom | Florian Gstrein, Eungnak Han, Rami Hourani, Paul A. Nyhus, Manish Chandhok +2 more | 2022-08-16 |
| 11322504 | Ferroelectric-capacitor integration using novel multi-metal-level interconnect with replaced dielectric for ultra-dense embedded SRAM in state-of-the-art CMOS technology | Uygar E. Avci, Daniel H. Morris, Seiyon Kim, Yih Wang, Ian A. Young | 2022-05-03 |