| 11532719 |
Transistors on heterogeneous bonding layers |
Jack T. Kavalieros, Gilbert Dewey, Willy Rachmady, Aaron D. Lilak, Brennen Mueller +5 more |
2022-12-20 |
| 11482621 |
Vertically stacked CMOS with upfront M0 interconnect |
Willy Rachmady, Patrick Morrow, Aaron D. Lilak, Rishabh Mehandru, Cheng-Ying Huang +4 more |
2022-10-25 |
| 11430814 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more |
2022-08-30 |
| 11393777 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Brennen Mueller, Shawna M. Liff +2 more |
2022-07-19 |
| 11393818 |
Stacked transistors with Si PMOS and high mobility thin film transistor NMOS |
Gilbert Dewey, Ravi Pillarisetty, Abhishek A. Sharma, Aaron D. Lilak, Willy Rachmady +5 more |
2022-07-19 |
| 11348897 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2022-05-31 |
| 11264493 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Il-Seok Son, Donald W. Nelson |
2022-03-01 |
| 11251156 |
Fabrication and use of through silicon vias on double sided interconnect device |
Brennen Mueller, Patrick Morrow, Paul B. Fischer, Daniel Pantuso |
2022-02-15 |
| 11251158 |
Monolithic chip stacking using a die with double-sided interconnect layers |
Anup Pancholi |
2022-02-15 |
| 11244943 |
Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material |
Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Willy Rachmady, Zachary Geiger +5 more |
2022-02-08 |