| 11437317 |
Single-mask alternating line deposition |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-09-06 |
| 11430735 |
Barrier removal for conductor in top via integration scheme |
Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Lawrence A. Clevenger, Robert R. Robison |
2022-08-30 |
| 11315872 |
Self-aligned top via |
Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng, Chih-Chao Yang |
2022-04-26 |
| 11309383 |
Quad-layer high-k for metal-insulator-metal capacitors |
Takashi Ando, Paul C. Jamison, John G. Massey, Eduard A. Cartier |
2022-04-19 |
| 11302575 |
Subtractive line with damascene second line type |
Brent A. Anderson, Christopher J. Penny, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-04-12 |
| 11295978 |
Interconnects having spacers for improved top via critical dimension and overlay tolerance |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison |
2022-04-05 |
| 11289371 |
Top vias with selectively retained etch stops |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-03-29 |
| 11276639 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison |
2022-03-15 |
| 11276611 |
Top via on subtractively etched conductive line |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison |
2022-03-15 |
| 11232977 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-01-25 |
