Issued Patents 2022
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430690 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2022-08-30 |
| 11410879 | Subtractive back-end-of-line vias | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2022-08-09 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Joseph F. Maniscalco, Kenneth Chun Kuen Cheng, Oscar van der Straten, Alexander Reznicek | 2022-07-05 |
| 11315872 | Self-aligned top via | Chanro Park, Kenneth Chun Kuen Cheng, Kisik Choi, Chih-Chao Yang | 2022-04-26 |
| 11289375 | Fully aligned interconnects with selective area deposition | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2022-03-29 |
| 11282768 | Fully-aligned top-via structures with top-via trim | Kenneth Chun Kuen Cheng, Brent A. Anderson, Joseph F. Maniscalco | 2022-03-22 |
| 11276636 | Adjustable via dimension and chamfer angle | Lawrence A. Clevenger, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Benjamin D. Briggs, Michael Rizzolo | 2022-03-15 |
| 11270913 | BEOL metallization formation | Chanro Park, Kenneth Chun Kuen Cheng, Brent A. Anderson, Somnath Ghosh | 2022-03-08 |
| 11244897 | Back end of line metallization | Chanro Park, Kenneth Chun Kuen Cheng, Somnath Ghosh, Chih-Chao Yang | 2022-02-08 |
| 11244853 | Fully aligned via interconnects with partially removed etch stop layer | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2022-02-08 |
| 11244854 | Dual damascene fully aligned via in interconnects | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2022-02-08 |
| 11244859 | Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line | Cornelius Brown Peethala, Christopher J. Penny, Nicholas Anthony Lanzillo, Lawrence A. Clevenger | 2022-02-08 |
| 11244860 | Double patterning interconnect integration scheme with SAV | Shyng-Tsong Chen, Terry A. Spooner, Chih-Chao Yang | 2022-02-08 |
| 11239414 | Physical unclonable function for MRAM structures | Ruilong Xie, Alexander Reznicek, Oscar van der Straten | 2022-02-01 |
| 11239278 | Bottom conductive structure with a limited top contact area | Chih-Chao Yang, Baozhen Li, Theodorus E. Standaert | 2022-02-01 |
| 11227792 | Interconnect structures including self aligned vias | Chih-Chao Yang, Terry A. Spooner, Shyng-Tsong Chen | 2022-01-18 |
| 11217481 | Fully aligned top vias | Nicholas Anthony Lanzillo, Somnath Ghosh, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2022-01-04 |