Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404311 | Metallic interconnect structures with wrap around capping layers | Kedari Matam, Chih-Chao Yang, Theo Standaert | 2022-08-02 |
| 11322361 | Selective etching of silicon wafer | Da Song, Allan Upham, Kevin R. Winstel, Spyridon Skordas | 2022-05-03 |
| 11315830 | Metallic interconnect structures with wrap around capping layers | Kedari Matam, Chih-Chao Yang, Theo Standaert | 2022-04-26 |
| 11276636 | Adjustable via dimension and chamfer angle | Lawrence A. Clevenger, Koichi Motoyama, Gangadhara Raja Muthinti, Benjamin D. Briggs, Michael Rizzolo | 2022-03-15 |
| 11251126 | Replacement metal cap by an exchange reaction | James J. Kelly | 2022-02-15 |
| 11244859 | Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line | Koichi Motoyama, Christopher J. Penny, Nicholas Anthony Lanzillo, Lawrence A. Clevenger | 2022-02-08 |