Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11458474 | Microfluidic chips with one or more vias | Joshua T. Smith, William Francis Landers, Teresa J. Wu | 2022-10-04 |
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2022-10-04 |
| 11322361 | Selective etching of silicon wafer | Da Song, Allan Upham, Cornelius Brown Peethala, Spyridon Skordas | 2022-05-03 |