Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355379 | Oxide-bonded wafer pair separation using laser debonding | Mukta G. Farooq, Dale Curtis McHerron | 2022-06-07 |
| 11322361 | Selective etching of silicon wafer | Da Song, Allan Upham, Cornelius Brown Peethala, Kevin R. Winstel | 2022-05-03 |
| 11239167 | Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate | Mukta G. Farooq, Ravi K. Bonam, James J. Kelly | 2022-02-01 |