Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11480868 | Determination of optical roughness in EUV structures | Gangadhara Raja Muthinti | 2022-10-25 |
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2022-10-04 |
| 11239167 | Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate | Mukta G. Farooq, James J. Kelly, Spyridon Skordas | 2022-02-01 |