Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527462 | Circuit substrate with mixed pitch wiring | Katsuyuki Sakuma, Shidong Li | 2022-12-13 |
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2022-10-04 |
| 11410905 | Optimized weight heat spreader for an electronic package | Kenneth C. Marston, Tuhin Sinha, Shidong Li | 2022-08-09 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11264306 | Hybrid TIMs for electronic package cooling | Piyas Bal Chowdhury, James J. Kelly, Jeffrey A. Zitz, Sushumna Iruvanti, Shidong Li | 2022-03-01 |