Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Mark W. Kapfhammer | 2022-12-06 |
| 11390107 | Object marking for optical authentication and method for producing same | — | 2022-07-19 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer, Bhupender Singh | 2022-07-19 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Charles L. Arvin, Bhupender Singh, Brian W. Quinlan | 2022-03-22 |
| 11281954 | Tamper-activated authenticable security device | Thomas Bergmüller | 2022-03-22 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles L. Arvin, Steven P. Ostrander | 2022-02-01 |
| 11235404 | Personalized copper block for selective solder removal | Charles L. Arvin, Luca Del Carro, Thomas J. Brunschwiler, Chris Muzzy | 2022-02-01 |
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Steven P. Ostrander, Thomas E. Lombardi | 2022-01-18 |