Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11308257 | Stacked via rivets in chip hotspots | Dureseti Chidambarrao, David Wolpert, Atsushi Ogino, Matthew T. Guzowski, Tuhin Sinha +1 more | 2022-04-19 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles L. Arvin, Thomas Weiss | 2022-02-01 |
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Thomas Weiss, Thomas E. Lombardi | 2022-01-18 |