Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302205 | Language learning and speech enhancement through natural language processing | Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny +1 more | 2022-04-12 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Thomas Weiss, Charles L. Arvin, Bhupender Singh, Brian W. Quinlan | 2022-03-22 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Brian W. Quinlan, Charles L. Arvin, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |