Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2022-12-06 |
| 11410894 | Polygon integrated circuit (IC) packaging | Charles L. Arvin, Richard F. Indyk, Jon A. Casey, Shidong Li | 2022-08-09 |
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Sylvain Pharand | 2022-08-02 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer | 2022-07-19 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Thomas Weiss, Charles L. Arvin, Brian W. Quinlan | 2022-03-22 |