Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Bhupender Singh, Mark W. Kapfhammer, Brian W. Quinlan | 2022-08-02 |
| 11310921 | Buried via in a circuit board | Kyle Indukummar Giesen, Matteo Cocchini | 2022-04-19 |