Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2022-12-06 |
| 11410894 | Polygon integrated circuit (IC) packaging | Richard F. Indyk, Bhupender Singh, Jon A. Casey, Shidong Li | 2022-08-09 |
| 11404365 | Direct attachment of capacitors to flip chip dies | Bhupender Singh, Mark W. Kapfhammer, Brian W. Quinlan, Sylvain Pharand | 2022-08-02 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Thomas Weiss, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer, Bhupender Singh | 2022-07-19 |
| 11388821 | Thin film capacitors for core and adjacent build up layers | Brian W. Quinlan, Charles L. Reynolds, Jean Audet, Francesco Preda | 2022-07-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Thomas Weiss, Bhupender Singh, Brian W. Quinlan | 2022-03-22 |
| 11270964 | Mixed UBM and mixed pitch on a single die | Christopher D. Muzzy | 2022-03-08 |
| 11235404 | Personalized copper block for selective solder removal | Luca Del Carro, Thomas J. Brunschwiler, Thomas Weiss, Chris Muzzy | 2022-02-01 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |